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[(Integrated Circuit, Hybrid and Multichip Module Package Design)] [By (author) Michael Pecht] published on
March, 1994
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(Quality Conformance and Qualification of Microelectronic Packages and Interconnects ) - Author: Michael Pecht - Jan-1995
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Reliability Engineering
Wiley Series in Systems Engineering and Management Book 86
ByBindingKindle EditionBrandWileyFormatKindle eBookRelease Date2014-03-21 -
Strategies to the Prediction, Mitigation and Management of Product Obsolescence
Wiley Series in Systems Engineering and Management Book 87
ByBindingKindle EditionBrandWileyFormatKindle eBookRelease Date2012-04-04 -
Encapsulation Technologies for Electronic Applications
Materials and Processes for Electronic Applications Book 3
ByBindingKindle EditionBrandWilliam AndrewFormatKindle eBookRelease Date2009-07-22
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![[(Contamination of Electronic Assemblies)] [By (author) Michael Pecht ] published on](https://m.media-amazon.com/images/I/41I488OTT7L._AC_SS400_.jpg)
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![[(Integrated Circuit, Hybrid and Multichip Module Package Design)] [By (author) Michael Pecht] published on](https://m.media-amazon.com/images/I/51PqBdamUvL._AC_SS400_.jpg)
![[(Soldering Processes and Equipment)] [Edited by Michael Pecht] published on](https://m.media-amazon.com/images/I/410rcpklo7L._AC_SS400_.jpg)




